Products

Advanced materials for electronics assembly and semiconductor packaging

# Sintering Solutions

Pressure Sinter Ag

High-reliability die attach for power modules

PMAg02

Standard for IGBT & SiC power modules

Pressure SinterSemiconductorAutomotive

FC-325LA

Low-temperature (200°C) for large-area sintering

Pressure SinterLow TempLarge Area

Pressureless Sinter Ag

Flexible processing without external pressure

PMAg01

High thermal conductivity >200 W/(m·K)

PressurelessHigh PerformanceAI & 5G

PL-400CP

Direct bonding on bare copper substrates

PressurelessCost EffectiveBare Cu

PL-500LT

Low-temperature curing from 180°C

PressurelessLow TempFlexible Electronics

Sinter Copper

Cost-effective alternative to silver

FC-100U

Pressure sinter, >180 W/(m·K), die-size sintering

PressureCopperAutomotive

FC-200U

Coming Soon

Pressure sinter, large-area optimized

PressureCopperLarge Area

PL-02U

Pressureless, high thermal conductivity

PressurelessCopperLead-Free Alternative

Hybrid Sinter Ag

Stress buffering and high reliability

JL-LM02

Low modulus resin absorbs thermal stress

HybridFlexibleAI & 5G

# Conductive Inks & Pastes

Copper Series

Cost-effective, high-performance copper solutions

JL-CS01

Conductive copper for RFID & FPC

CopperSolderableFlexible Circuits

JL-CS-F01

Solvent-free copper paste for reliable thermal via filling

Via FillingPCB Assembly

Specialty Inks & Assembly Materials

Advanced solutions for precision bonding, sensors, and passive components

CP-500

Stable carbon paste for printed resistors and heating elements

CarbonSwitchesHeaters

JL-LG02

Precision silver epoxy adhesive

AdhesiveSilverPrecision

Ag/AgCl Paste

Coming Soon

Bio-compatible for ECG & biosensors

SilverBio-compatibleMedical

Edge/Perimeter Ag

Coming Soon

For MLPC manufacturing

SilverMLPCComponents

Terminal Electrode Ag

Coming Soon

For chip components

SilverTerminalsChip Components