PL-02U
Pressureless, high thermal conductivity
PressurelessCopperLead-Free Alternative
Specifications
ApplicationHigh thermal
ProcessPressureless
Thermal Cond.>110 W/(m·K)
Resistivity2.4×10⁻⁴ Ω·cm
Temp.240-260°C
AtmosphereN₂/Formic
Applications
- •Pressureless
- •Copper
- •Lead-Free Alternative