PL-400CP
Direct bonding on bare copper substrates
PressurelessCost EffectiveBare Cu
Specifications
ApplicationBare copper
Thermal Cond.>200 W/(m·K)
Resistivity6×10⁻⁶ Ω·cm
Temp.200-260°C
AtmosphereN₂
Applications
- •Pressureless
- •Cost Effective
- •Bare Cu