JL-CS-F01
Solvent-free copper paste for reliable thermal via filling
Via FillingPCB Assembly
Specifications
ApplicationVia Filling
MaterialCopper
Resistivity10⁻⁴ Ω·cm
Curing Profile170-180°C 60-90min
Applications
- •Via Filling
- •PCB Assembly
Solvent-free copper paste for reliable thermal via filling