JL-LM02
Low modulus resin absorbs thermal stress
HybridFlexibleAI & 5G
Specifications
ApplicationHybrid/Low modulus
Thermal Cond.>100 W/(m·K)
Resistivity<10⁻⁵ Ω·cm
Temp.200°C
AtmosphereAir/N₂
Applications
- •Hybrid
- •Flexible
- •AI & 5G
Low modulus resin absorbs thermal stress