PMAg02
Standard for IGBT & SiC power modules
Pressure SinterSemiconductorAutomotive
Specifications
ApplicationDie-size
Thermal Cond.>200 W/(m·K)
Resistivity<6×10⁻⁶ Ω·cm
Temp.230-260°C
Pressure10-20 MPa
Shear Strength>65 MPa
Applications
- •Pressure Sinter
- •Semiconductor
- •Automotive