Elevating Electronics Assembly.Pioneering Semiconductor Packaging.
Joinspire expertise lies in enabling electronics assemblers, PCB fabricators and semiconductor packaging manufacturers globally to elevate the reliability, efficiency and sustainability of products.
Non-pressure Sinter Silver Paste
- High thermal conductivity, >200 W/(m·K)
- High electrical conductivity
- Steady dispensing performance
- Advanced nano silver technology
- Low porosity, viscosity can be adjusted
Pressure Sinter Silver Paste
- Standard product for pressure sintering
- Applicable on Ni/Au, Ag, Cu
- Low porosity
- Excellent stencil printing workability
- High shear strength