Semiconductor Packaging
Advanced sintering materials are revolutionizing semiconductor packaging by enabling superior thermal management and electrical performance. As chip designs become more complex and power densities increase, traditional solder-based die attach methods are reaching their limits. Our nano-silver and copper sintering pastes provide the next-generation solution for high-reliability semiconductor applications.
Key Capabilities
Superior Thermal Management
Achieve thermal conductivity exceeding 200 W/(m·K), significantly outperforming traditional solder materials and enabling efficient heat dissipation from high-power semiconductor devices.
High Reliability
Low porosity sintered joints with shear strength exceeding 40 MPa ensure long-term reliability under thermal cycling and harsh operating conditions.
High-Density Packaging
Fine-pitch dispensing and printing capabilities support advanced 2.5D and 3D packaging architectures with precise material placement.
Benefits
Enhanced Device Performance
Better thermal management enables higher switching frequencies and power densities while maintaining junction temperatures within safe limits.
Extended Product Lifespan
Sintered joints maintain their properties over extended temperature cycling, reducing failure rates and extending product warranty periods.
Manufacturing Efficiency
Compatible with existing die attach equipment and processes, minimizing integration costs while maximizing throughput.
Related Products
Ready to upgrade your packaging process?
Our semiconductor materials experts can help you select the optimal sintering solution for your specific device requirements.