PCB & Electronic Assembly
Modern PCB fabrication and electronic assembly require advanced interconnect materials that deliver both electrical performance and manufacturing reliability. Our conductive pastes and via filling solutions address the challenges of high-density interconnect (HDI) boards and complex multilayer assemblies.
Key Capabilities
High Conductivity
Low bulk resistivity ensures minimal signal loss and efficient current carrying capacity for power distribution networks.
Excellent Adhesion
Strong bonding to copper, nickel, and various substrate materials provides reliable interconnects that withstand thermal stress.
Flexible Processing
Compatible with screen printing, stencil printing, and dispensing for various via sizes and aspect ratios.
Benefits
Improved Reliability
Void-free via filling and robust solder joints reduce failure rates in high-reliability applications.
Cost Reduction
Streamlined processing and high yield rates lower overall manufacturing costs compared to traditional methods.
Design Flexibility
Support for fine-pitch features and complex geometries enables innovative board designs and miniaturization.
Related Products
Enhance your PCB manufacturing capabilities
Learn how our advanced materials can improve your fabrication processes and product quality.