Laser & Photonics
Laser diodes and photonic devices demand exceptional thermal management to maintain wavelength stability and optical performance. Our sintering materials provide the thermal interface solutions needed for high-power laser applications, from telecommunications to industrial manufacturing.
Key Capabilities
Precision Die Bonding
Sub-micron thickness control and void-free joints ensure optimal optical alignment and thermal contact for laser diode mounting.
Efficient Heat Extraction
High thermal conductivity enables rapid heat removal from active regions, preventing thermal rollover and maintaining lasing efficiency.
Long-Term Stability
Stable microstructure prevents degradation under high-temperature operation, ensuring consistent performance over thousands of hours.
Benefits
Higher Output Power
Improved thermal management allows operation at higher drive currents without compromising device reliability or beam quality.
Wavelength Stability
Reduced junction temperature variation minimizes wavelength drift, critical for precision spectroscopy and telecommunications.
Compact Designs
Superior thermal performance enables smaller heat sinks and more compact module designs without sacrificing performance.
Related Products
Optimize your photonic device thermal design
Consult with our photonics specialists to find the ideal thermal interface solution for your application.