AI & 5G Infrastructure
Artificial intelligence and 5G communications demand unprecedented computing power and data throughput. Our advanced materials address the thermal and electrical challenges of high-performance processors, accelerators, and RF components that power the next generation of digital infrastructure.
Key Capabilities
High-Frequency Performance
Low-loss interconnects maintain signal integrity at mmWave frequencies critical for 5G and satellite communications.
Extreme Heat Dissipation
Handle the intense thermal loads of GPUs, TPUs, and high-power RF amplifiers with thermal conductivity exceeding 200 W/(m·K).
Signal Integrity
Controlled impedance and minimal parasitic effects ensure clean signal transmission in high-speed digital systems.
Benefits
Data Center Computing
Enable higher rack densities and improved energy efficiency in hyperscale data center deployments.
5G Base Stations
Reliable operation of massive MIMO antennas and RF front-ends in outdoor telecommunications equipment.
Edge Computing
Compact, high-performance packaging for AI inference at the network edge in space-constrained deployments.
Related Products
Power the future of connectivity
Work with our team to optimize thermal performance for your AI and 5G applications.