Joinspire

# PRODUCTS

Crafting Quality. Enhancing Reliability. Ensuring Sustainability.

Non-pressure sinter silver paste

Application: 5G, Power Amplifier, High power LED, Laser, mm-wave semiconductor, SiC discrete device

  • High thermal conductivity, >200 W/(m·K)
  • High electrical conductivity
  • Steady dispensing performance
  • Advanced nano silver technology
  • Low porosity, viscosity can be adjusted

JLSA-200E

  • Standard product can be processed on Ni/Au, Ag

JLCP-200

  • Could be applied on bare copper interface
Non-pressure sinter silver paste

Pressure sinter silver paste

Application: Automobile, Power electronics & Power module, Photovoltaic, Railway, Aerospace, Power grid, High temperature sensor

  • Standard product for pressure sintering
  • Applicable on Ni/Au, Ag, Cu
  • Low porosity
  • Excellent stencil printing workability
  • High shear strength

JLFC-3200

  • Standard product for pressure sintering
  • Applicable on Ni/Au, Ag, Cu
  • Low porosity
  • Excellent stencil printing workability
  • High shear strength
Pressure sinter silver paste