Non-pressure sinter silver paste

Application: 5G, Power Amplifier, High power LED, Laser, mm-wave semiconductor, SiC discrete device

  • High thermal conductivity (＞200 W/(m·K) )
  • High electrical conductivity
  • Steady dispensing performance
  • Advanced nano silver technology
  • Low porosity
  • Viscosity can be adjusted if needed

JLSA-200E

  • Standard product can be processed on Ni/Au, Ag

JLCP-200

  • Could be applied on bare copper interface

Pressure sinter silver paste

Application: Automobile, Power electronics & Power module, Photovoltaic, Railway, Aerospace, Power grid, High temperature sensor

    JLFC-3200

    • Standard product for pressure sintering
    • Applicable on Ni/Au, Ag, Cu
    • Low porosity
    • Excellent stencil printing workability
    • High shear strength