Silver Prices Soaring and Costs Rising?

Meet Joinspire’s Sintered Copper Paste: The New Cost-Breaking Solution for High-Power Semiconductor Packaging!

Recently, international silver prices have surged past $67 per ounce, marking an increase of nearly 130%. This wave of price hikes has rapidly rippled through the global manufacturing supply chain. The impact is particularly severe in the high-power semiconductor packaging sector—especially for "heavy silver users" like Photovoltaics (PV), New Energy Vehicles (NEVs), and Chip Packaging.

Sintered silver paste is a critical consumable in semiconductor packaging. As silver prices climb, the cost of these materials has skyrocketed. For manufacturers, this intensifying cost pressure has become an urgent challenge that demands an immediate solution.

The Key to Breaking the Cost Barrier: Sintered Copper

A Premium Alternative for High-Power Packaging

Copper sintering technology—offering comparable performance with controllable costs—is emerging as the perfect alternative to sintered silver.

Comparable Performance: It boasts electrical and thermal conductivity close to that of silver.

High Reliability: It offers excellent oxidation resistance and long-term reliability, fully meeting the stringent requirements of automotive-grade and industrial-grade applications.

The Cost Advantage: Most importantly, copper offers a significant and stable cost benefit.

With silver prices remaining high and volatile, adopting copper sintering technology is undeniably the smarter choice for cost reduction and efficiency in high-power semiconductor packaging.

Staying Ahead of the Curve

Joinspire Leads the Race in Advanced Packaging Materials

As an innovator deeply rooted in the field of advanced packaging materials, Joinspire (Guangdong Joinspire Technology Co., Ltd.) leveraged sharp industry insights to prioritize the R&D of sintered copper materials early on.

Today, our sintered copper technology is mature and deployed. Thanks to its high thermal conductivity, superior electrical properties, and excellent thermal/mechanical stability, it has become a competitive core material in advanced packaging. We are currently helping enterprises achieve a smooth, cost-optimizing transition from "Silver Sintering" to "Copper Sintering."

1. FC-100U Pressure Sintered Copper Paste

Process Fit: Designed specifically for pressure sintering scenarios; compatible with mainstream pressure sintering equipment.

Interface Compatibility: Suitable for Gold (Au), Silver (Ag), and Copper (Cu) interfaces; compatible with both printing and dispensing processes.

Key Advantages: High thermal/electrical conductivity, high die shear strength, high operating temperature, and fully REACH/RoHS compliant.

2. PL-02U Pressure-less Sintered Copper

Process Fit: Pressure-less sintering, ideal for high-power chips.

Interface Compatibility: Adapts to common interfaces like Gold, Silver, and Copper; compatible with printing and dispensing processes.

Core Value: Provides a high-thermal, high-strength connection solution for chips or devices that cannot withstand pressure.

Guangdong Joinspire Technology Co., Ltd. is dedicated to helping your business cut costs and boost competitiveness with high-performance, cost-effective packaging solutions. Our professional team is standing by online to provide full technical support.

Reach out to us today to learn more!