Joinspire Technology Embarks on 2026 Global Journey with a Successful Showcase at NEPCON JAPAN

TOKYO, Japan – As the new year unfolds with renewed vitality, Joinspire Technology officially kicked off its 2026 international expansion with a high-profile debut at NEPCON JAPAN 2026 (The 40th Electronics R&D, Manufacturing and Packaging Technology Expo). The event served as a premier stage to demonstrate the robust technical prowess and brand charisma of Chinese innovation to the global electronics manufacturing industry.

The three-day flagship event, held from January 21 to 23, 2026, concluded with great success for the Joinspire team. As one of the most influential electronics manufacturing exhibitions in Japan and Asia, NEPCON JAPAN brought together industry leaders and professional buyers from across the globe, providing a high-efficiency platform for technical exchange and commercial synergy.

For this inaugural exhibition of the year, Joinspire meticulously presented its core product portfolio, featuring:

Maxilver® Sinter Silver Series

CuTenix® All-Sinter Copper Series

Maxilver® Conductive Silver Paste Series

CuTenix® Conductive Copper Paste Series

Leveraging exceptional product stability and superior performance, Joinspire’s booth witnessed a constant influx of visitors. The overwhelming interest and in-depth consultations from industry professionals made Joinspire one of the standout focal points of the entire exhibition.

Throughout the event, Joinspire’s technical team engaged with global clients with professional expertise and dedicated service. The team provided detailed breakdowns of core product advantages and application scenarios while offering precise solutions to complex technical challenges. Their professional excellence earned widespread client recognition, resulting in preliminary cooperation agreements with several high-potential partners. This performance fully demonstrated Joinspire’s core competitiveness as a "Specialized, Refined, Differential, and Innovative" (SRDI) enterprise in semiconductor packaging materials, laying a solid foundation for further expansion into the Japanese and global high-end markets.

Looking ahead in 2026, Joinspire Technology will build on this momentum by continuing to increase R&D investment. Focusing on core sectors such as semiconductor packaging and automotive electronics, Joinspire is committed to delivering innovative products tailored to international market demands, empowering the global electronics industry with advanced material solutions.