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Latest updates on semiconductor packaging, advanced materials, and industry innovations.
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Demand for this SiC Material to Surge by 700%: How Joinspire is Seizing the First-Mover Advantage
As the demand for sintering materials is projected to surge by 700%, Joinspire is seizing the first-mover advantage with its high-performance sintered silver paste. Discover how Joinspire’s next-generation die-attach materials outperform traditional AuSn solders across...
PCIM Europe 2026 Recap: Joinspire Showcases Advanced Packaging Materials for SiC
Joinspire presented its silver and copper sintering materials, conductive pastes, and automotive-grade quality systems at PCIM Europe 2026 in Nuremberg.
AI Chip Power Soars: Joinspire’s Via-Filling Copper Paste Unlocks the Next-Generation HDI Interconnect Bottleneck
As AI chip power consumption surges past 2 kW, traditional HDI PCB via-plugging materials face severe thermal and reliability bottlenecks. Discover how Joinspire’s JL-CS-F01 via-filling copper paste solves this challenge with ultra-high thermal conductivity (124 W/m·K),...
More Than Lead-Free: How Joinspire Overcame the Pressureless Copper Sintering Challenge to Drive SiC/GaN Upgrades
Breakthrough in copper sintering! Joinspire overcomes the industry-wide challenge of copper oxidation with its PL-02U pressureless sintering copper paste. Tailored for next-generation SiC and GaN power devices, PL-02U combines high thermal conductivity (>110 W/m·K) and...
The Copper Renaissance: Optimizing Data Center Interconnects for the AI Era | Joinspire Research
As the global demand for AI and high-performance computing (HPC) accelerates, Data Center infrastructure is undergoing a massive transformation. Market projections suggest North American data center infrastructure alone could hit $185 billion by 2040, with a critical fo...
Joinspire Technology Embarks on 2026 Global Journey with a Successful Showcase at NEPCON JAPAN
TOKYO, Japan – As the new year unfolds with renewed vitality, Joinspire Technology officially kicked off its 2026 international expansion with a high-profile debut at NEPCON JAPAN 2026 (The 40th Electronics R&D, Manufacturing and Packaging Technology Expo). The event se...
Joinspire Sintered Silver Won the Excellence Award of the 15th China Innovation & Entrepreneurship Competition!
On December 6, 2023, Guangdong Joinspire Technology Co., Ltd. won the 15th China Innovation and Entrepreneurship Competition (Shenzhen Division) (hereinafter referred to as "Shenzhen Division") with its entry project "High-Performance Power Semiconductor Packaging Mater...
Silver Prices Soaring and Costs Rising? Meet Joinspire’s Sintered Copper Paste
Meet Joinspire’s Sintered Copper Paste: The New Cost-Breaking Solution for High-Power Semiconductor Packaging!
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